To All Hardware Designers,

The Huntsville Chapter of the IEEE Electromagnetic Compatibility (EMC) Society is hosting:
“EMC 2010: SI and EMC – A Twisted Pair” on Tuesday, April 20th at the Von Braun Center.

The one day engineering seminar presenter is Dr. Eric Bogatin of Bogatin Enterprises LLC. Dr. Bogatin is an IEEE Distinguished Lecturer (DL) and for the past 20 years has widely taught and authored numerous papers and books on the topic of signal integrity (SI) and high speed printed circuit board (PCB) design. Dr. Bogatin has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft and Interconnect Devices.

The subjects of SI and EMC are deeply intertwined and both are critical to the reliability and performance of modern electronic systems. Engineers either working in or interested in the fields of SI or EMC will come to appreciate how robust engineering practices in one field will pay off with significant dividends in the companion field.

Dr Bogatin will explore practical differential pair design, how to select capacitors for a robust power distribution network, how to utilize S-Parameters for insight into SI and EMC performance, and how to correctly engineer current return paths to minimize ground bounce and noise that commonly degrade digital system performance.

Please visit HuntsvilleEMC for further information and to register online.  View the event brochure here.