Signal Integrity and EMC – A Twisted Pair
The Huntsville Chapter of the IEEE Electromagnetic Compatibility (EMC) Society is hosting:
“EMC 2010: SI and EMC – A Twisted Pair” on Tuesday, April 20th at the Von Braun Center.The one day engineering seminar presenter is Dr. Eric Bogatin of Bogatin Enterprises LLC. Dr. Bogatin is an IEEE Distinguished Lecturer (DL) and for the past 20 years has widely taught and authored numerous papers and books on the topic of signal integrity (SI) and high speed printed circuit board (PCB) design…